115 kbps Transceiver
GP2W0104YP
PRECAUTIONS FOR SOLDERING
Solder Reflow
Solder only once at the temperature and the time
within the temperature profile as shown in Figure 14.
may break if the deformation of the PCB affects the lead
pins. Use after fully confirming the conditions of actual
solder reflow machine.
Soldering
• Soldering iron shall be less than 25 W, and temper-
ature of soldering iron point shall be used at less
than 260°C.
• Soldering time shall be within 5 seconds.
• Soldered product shall treat at normal temperature.
• Solder: 6/4 solder or included Ag solder.
Other Precautions
An infrared lamp used to heat up for soldering may
cause a localized temperature rise in the resin. So keep
the package temperature within that specified in Figure
14. Also avoid immersing the resin part in the solder.
Even if within the temperature profile shown in Figure 14,
there is the possibility that the gold wire in the package
230°C
MAX.
200°C
1 - 4°C/s
165°C
MAX.
1 - 4°C/s
1 - 4°C/s
25°C
5 s MAX.
60 s MAX.
120 s MAX.
90 s MAX.
GP2W0104YP-14
Figure 14. Temperature Profile
IrDA Data Sheet
9
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
