Si5310
Table 5. Minimum Jitter Tolerance in Nanoseconds* (MULTSEL = 0, MULTOUT = 600 to 668 MHz)
Frequency (Hz)
< 300
25K
250K
> 1M
37.5–41.75 MHz
Clock Input
25.0
1.6
1.6
0.3
75–83.5 MHz
Clock Input
25.0
3.2
3.2
0.3
150–167 MHz
Clock Input
25.0
6.5
3.0
0.5
300–334 MHz
Clock Input
25.0
16
3.2
0.5
*Note:
Measured using sinusoidal jitter at stated Test Condition frequency.
Table 6. Minimum Jitter Tolerance in Nanoseconds* (MULTSEL = 1, MULTOUT = 150 to 167 MHz)
Frequency (Hz)
< 300
6.5K
65K
325K
> 1M
9.375–10.438 MHz
Clock Input
66.7
6.4
1.2
1.2
1.2
18.75–20.875 MHz
Clock Input
66.7
13.0
1.9
1.9
1.9
37.5–41.75 MHz
Clock Input
66.7
29.0
1.9
1.9
1.9
75–83.5 MHz
Clock Input
66.7
33.3
4.8
2.6
1.9
*Note:
Measured using sinusoidal jitter at stated Test Condition frequency.
Table 7. Absolute Maximum Ratings
Parameter
DC Supply Voltage
LVTTL Input Voltage
Differential Input Voltages
Maximum Current any output PIN
Operating Junction Temperature
Storage Temperature Range
ESD HBM Tolerance (100 pf, 1.5 kΩ)
CLKIN+, CLKIN–, REFCLK+, REFCLK–,
All other pins
T
JCT
T
STG
—
—
Symbol
V
DD
V
DIG
V
DIF
Value
–0.5 to 2.8
–0.3 to 3.6
–0.3 to (V
DD
+ 0.3)
±50
–55 to 150
–55 to 150
1
1.5
Unit
V
V
V
mA
°C
°C
kV
kV
Note:
Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 8. Thermal Characteristics
Parameter
Thermal Resistance Junction to Ambient
Symbol
ϕ
JA
Test Condition
Still Air
Value
38
Unit
°C/W
10
Rev. 1.2
SILABS [ SILICON LABORATORIES ]
