Si5310
9. 4x4 mm 20L MLP Recommended PCB Layout
See Note 8
Gnd Pin
See Note 9
Gnd Pin
Symbol
A
D
e
G
R
X
Y
Z
Parameter
Min
Pad Row/Column Width/Length
Thermal Pad Width/Height
Pad Pitch
Pad Row/Column Separation
Pad Radius
Pad Width
Pad Length
Pad Row/Column Extents
2.23
2.03
—
2.43
—
0.23
—
4.26
Gnd Pin
Dimensions
Nom
2.25
2.08
0.50 BSC
2.46
0.12 REF
0.25
0.94 REF
4.28
Max
2.28
2.13
—
2.48
—
0.28
—
4.31
Notes:
1.
All dimensions listed are in millimeters (mm).
2.
The perimeter pads are to be Non-Solder Mask Defined (NSMD). Solder mask openings should be designed to leave 60-75 mm
separation between solder mask and pad metal, all the way around the pad.
3.
The center thermal pad is to be Solder Mask Defined (SMD).
4.
Thermal/Ground vias placed in the center pad should be no less than 0.2 mm (8 mil) diameter and tented from the top to prevent
solder from flowing into the via hole.
5.
The stencil aperture should match the pad size (1:1 ratio) for the perimeter pads. A 3x3 array of 0.5 mm square stencil openings, on a
0.65 mm pitch, should be used for the center thermal pad.
6.
A stencil thickness of 5 mil is recommended. The stencil should be laser cut and electropolished, with trapezoidal walls to facilitate
paste release.
7.
A “No-Clean”, Type 3 solder paste should be used for assembly. Nitrogen purge during reflow is recommended.
8.
Do not place any signal or power plane vias in these “keep out” regions.
9.
Suggest four 0.38 mm (15 mil) vias to the ground plane.
Rev. 1.2
23
SILABS [ SILICON LABORATORIES ]
