Si5310
8. Package Outline: Si5310
illustration.
D
D1
PIN1 ID
0.50 DIA.
20
A
A1
A2
A3
b
b
1
2
3
θ
e
e
D2
L
20
1
2
3
E1
E
E2
Top View
Side View
Bottom View
Figure 12. 20-pin Micro Leadframe Package (MLP)
Table 12. Package Dimensions
Symbol
Min
A
A1
A2
A3
b
D, E
0.18
—
0.00
—
Millimeters
Nom
0.85
0.01
0.65
0.20 REF.
0.23
4.00 BSC
0.30
Max
0.90
0.05
0.70
D1, E1
D2, E2
e
θ
L
—
0.50
1.95
Symbol
Min
Millimeters
Nom
3.75 BSC
2.10
0.50 BSC
—
0.60
12°
0.75
2.25
Max
Notes:
1.
Dimensioning and tolerances conform to ASME Y14.5M. - 1994
2.
Package warpage MAX 0.05 mm.
3.
“b” applies to plated terminal and is measured between 0.20 and 0.25 mm from terminal TIP.
4.
The package weight is approximately 42 mg.
5.
The mold compound for this package has a flammability rating of UL94-V0 with an oxygen index of 28
minimum/54 typical.
6.
The recommended reflow profile for this package is defined by the JEDEC-020B Small Body specification.
22
Rev. 1.2
SILABS [ SILICON LABORATORIES ]
