Si8440/41/42/45
5. Ordering Guide
Revision D devices are recommended for all new designs.
Table 15. Ordering Guide for Valid OPNs
Ordering Part
Number (OPN)
Number of
Number of
Inputs VDD1 Inputs VDD2
Side
Side
Maximum
Data Rate
(Mbps)
Isolation
Rating
Temp Range
Package Type
Revision D Devices
Si8440AA-D-IS1
Si8440BA-D-IS1
Si8441AA-D-IS1
Si8441BA-D-IS1
Si8442AA-D-IS1
Si8442BA-D-IS1
Si8445BA-D-IS1
Si8440AB-D-IS
Si8440BB-D-IS
Si8441AB-D-IS
Si8441BB-D-IS
Si8442AB-D-IS
Si8442BB-D-IS
Si8445BB-D-IS
Si8440AB-D-IS1
Si8440BB-D-IS1
Si8441AB-D-IS1
Si8441BB-D-IS1
Si8442AB-D-IS1
Si8442BB-D-IS1
Si8445BB-D-IS1
4
4
3
3
2
2
4
4
4
3
3
2
2
4
4
4
3
3
2
2
4
0
0
1
1
2
2
0
0
0
1
1
2
2
0
0
0
1
1
2
2
0
1
150
1
150
1
150
150
1
150
1
150
1
150
150
1
150
1
150
1
150
150
2.5 kVrms
–40 to 125 °C
NB SOIC-16
1
2.5 kVrms
–40 to 125 °C
WB SOIC-16
1,3
1 kVrms
–40 to 125 °C
NB SOIC-16
1
Notes:
1.
All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard
classifications and peak solder temperatures.
Moisture sensitivity level is MSL2A for wide-body SOIC-16 packages.
Moisture sensitivity level is MSL2A for narrow-body SOIC-16 packages.
2.
Revision C devices are supported for existing designs, but Revision D is recommended for all new designs.
3.
AEC-Q100 qualified.
Rev. 1.5
27
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