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    SiM3U156-B-GQ 参数 Datasheet PDF下载

    SiM3U156-B-GQ图片预览
    型号： SiM3U156-B-GQ
    PDF下载： 下载PDF文件 查看货源
    内容描述： 高性能，低功耗， 32位Precision32â ?? ¢ [High-Performance, Low-Power, 32-Bit Precision32™]
    分类和应用：
    文件页数/大小： 94 页 / 860 K
    品牌： SILABS [ SILICON LABORATORIES ]
     浏览型号SiM3U156-B-GQ的Datasheet PDF文件第1页浏览型号SiM3U156-B-GQ的Datasheet PDF文件第2页浏览型号SiM3U156-B-GQ的Datasheet PDF文件第3页浏览型号SiM3U156-B-GQ的Datasheet PDF文件第5页浏览型号SiM3U156-B-GQ的Datasheet PDF文件第6页浏览型号SiM3U156-B-GQ的Datasheet PDF文件第7页浏览型号SiM3U156-B-GQ的Datasheet PDF文件第8页浏览型号SiM3U156-B-GQ的Datasheet PDF文件第9页  
    SiM3U1xx
    4.6.5. SPI (SPI0, SPI1) .................................................................................................. 47
    4.6.6. I2C (I2C0, I2C1)................................................................................................... 47
    4.6.7. I2S (I2S0)............................................................................................................. 48
    4.7. Analog .......................................................................................................................... 49
    4.7.1. 12-Bit Analog-to-Digital Converters (SARADC0, SARADC1).............................. 49
    4.7.2. Sample Sync Generator (SSG0) ......................................................................... 49
    4.7.3. 10-Bit Digital-to-Analog Converter (IDAC0, IDAC1) ............................................ 49
    4.7.4. 16-Channel Capacitance-to-Digital Converter (CAPSENSE0) ............................ 50
    4.7.5. Low Current Comparators (CMP0, CMP1) .......................................................... 50
    4.7.6. Current-to-Voltage Converter (IVC0) ................................................................... 50
    4.8. Reset Sources..............................................................................................................51
    4.9. Security ........................................................................................................................ 52
    4.10.On-Chip Debugging ..................................................................................................... 52
    5. Pin Definitions and Packaging Information.....................................................................53
    5.1. SiM3U1x7 Pin Definitions............................................................................................. 53
    5.2. SiM3U1x6 Pin Definitions............................................................................................. 61
    5.3. SiM3U1x4 Pin Definitions............................................................................................. 68
    6. Ordering Information .........................................................................................................72
    6.1. LGA-92 Package Specifications...................................................................................74
    6.1.1. LGA-92 Solder Mask Design ............................................................................... 76
    6.1.2. LGA-92 Stencil Design ........................................................................................ 76
    6.1.3. LGA-92 Card Assembly ....................................................................................... 76
    6.2. TQFP-80 Package Specifications ................................................................................ 77
    6.2.1. TQFP-80 Solder Mask Design............................................................................. 80
    6.2.2. TQFP-80 Stencil Design ...................................................................................... 80
    6.2.3. TQFP-80 Card Assembly..................................................................................... 80
    6.3. QFN-64 Package Specifications .................................................................................. 81
    6.3.1. QFN-64 Solder Mask Design............................................................................... 83
    6.3.2. QFN-64 Stencil Design ........................................................................................ 83
    6.3.3. QFN-64 Card Assembly....................................................................................... 83
    6.4. TQFP-64 Package Specifications ................................................................................ 84
    6.4.1. TQFP-64 Solder Mask Design............................................................................. 87
    6.4.2. TQFP-64 Stencil Design ...................................................................................... 87
    6.4.3. TQFP-64 Card Assembly..................................................................................... 87
    6.5. QFN-40 Package Specifications .................................................................................. 88
    6.5.1. QFN-40 Solder Mask Design............................................................................... 90
    6.5.2. QFN-40 Stencil Design ........................................................................................ 90
    6.5.3. QFN-40 Card Assembly....................................................................................... 90
    7. Revision Specific Behavior............................................................................................... 91
    7.1. Revision Identification .................................................................................................. 91
    7.2. Comparator Rising/Falling Edge Flags in Debug Mode (CMP0, CMP1)...................... 92
    7.2.1. Problem ...............................................................................................................92
    7.2.2. Impacts ................................................................................................................ 92
    7.2.3. Workaround ......................................................................................................... 92
    7.2.4. Resolution............................................................................................................ 92
    Contact Information ................................................................................................................ 94
    4
    Preliminary Rev. 0.8

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