SGA-9289 Medium Power Discrete SiGe Transistor
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
Part Number Ordering Information
P art N umber
S GA -9289
S GA -9289Z
R eel S iz e
13"
13"
D evices/R eel
3000
3000
Pin Description
Pin #
1
2
3
4
Function
B a se
Emitter
Collector
Emitter
RF Input
Description
Connection to ground. Use via holes to reduce lead
inductance. Place vias as close to ground leads as possible.
RF Output
Same as Pin 2
Part Symbolization
The part will be symbolized with the “P2” (“P2Z”
for RoHS version) designator and a dot signifying
pin 1 on the top surface of the package.
Mounting and Thermal Considerations
It is very important that adequate heat sinking be provided to
minimize the device junction temperature. The following items
should be implemented to maximize MTTF and RF
performance.
Package Dimensions
.161
3
.177 .068
P2
.096
.016
.019 .118
4
1. Multiple solder-filled vias are required directly below the
ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with multiple plated-
through vias around pin 4 of the device. [CRITICAL]
3. Use two point board seating to lower the thermal
resistance between the PCB and mounting plate. Place
machine screws as close to the ground tab (pin 4) as
possible. [RECOMMENDED]
4. Use 2 ounce copper to improve the PCB’s heat spreading
capability. [RECOMMENDED]
1
2
.041
.059
.015
DIMENSIONS ARE IN INCHES
Recommended Mounting Configuration for
Optimum RF and Thermal Performance
Ground Plane
Plated Thru
Holes
(0.020" DIA)
SOT-89
Package
Machine
Screws
303 S. Technology Ct.
Broomfield, CO 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
EDS-101498 Rev G
4
SIRENZA [ SIRENZA MICRODEVICES ]
