SGC-4386Z 0.05-4.0 GHz Cascadeable MMIC Amplifier
86 PCB Pad Layout
Dimensions in inches [millimeters]
Notes:
1. Provide a large ground pad area under
device pins 2 and 4 with several plated-
through holes placed as shown.
2. 1-2 ounce finished copper thickness is
recommended.
3. RF I/O lines are 50Ω
RF
IN
RF
OUT
86 Nominal Package Dimensions
Dimensions in inches [millimeters]
A link to the 86 package outline drawing with full dimensions and toler-
ances may be found on the product web page at www.sirenza.com.
303 S. Technology Ct.
Broomfield, CO 80021
Phone: (800) SMI-MMIC
5
http://www.sirenza.com
EDS-104976 Rev C