Preliminary
SUF-4000 0.15-10 GHz Cascadable MMIC Amplifier
Pad Description
1
2
Pad #
Function
Description
1
2
Die
Bottom
This pad is DC coupled and matched to 50 Ohms.
An external DC block is required.
This pad is DC coupled and matched to 50 Ohms.
RF
OUT
/ Bias
Bias is applied through this pad.
RF
IN
GND
Die bottom must be connected to RF/DC ground
using silver-filled conductive epoxy.
Notes:
1. All Dimensions in Inches [Millimeters].
2. No connection required for unlabeled bond pads.
3. Die Thickness is 0.004 (0.100).
4. Typical bond pad is 0.004 (0.100) square.
5. Backside metalization: Gold.
6. Backside is Ground.
7. Bond pad metalization: Gold.
Device Assembly
+5V
Interconnect
Wire or Ribbon
Choke
50
Ω
Line
DC Block
50
Ω
Line
DC Block
3-5 mil gap
303 S. Technology Ct.
Broomfield, CO 80021
Phone: (800) SMI-MMIC
4
http://www.sirenza.com
EDS-105418 Rev A
SIRENZA [ SIRENZA MICRODEVICES ]
