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S25FL032A0LMFI001 参数 Datasheet PDF下载

S25FL032A0LMFI001图片预览
型号: S25FL032A0LMFI001
PDF下载: 下载PDF文件 查看货源
内容描述: 32兆位CMOS 3.0伏闪存与50MHz的SPI (串行外设接口)总线 [32 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus]
分类和应用: 闪存
文件页数/大小: 36 页 / 944 K
品牌: SPANSION [ SPANSION ]
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D a t a S h e e t ( P r e l i m i n a r y )  
18. Revision History  
Section  
Revision A (August 10, 2005)  
Global  
Description  
Initial release.  
Revision B0 (April 16, 2006)  
Changed document status from Advance Information to Preliminary. Changed title from family of  
devices to specific device.  
Global  
Revision B1 (June 29, 2006)  
DC Characteristics  
Changed typical and maximum specifications for ICC2  
.
Revision C0 (September 1, 2006)  
Global  
Rewrote entire document for better flow and clarity. No specifications were changed.  
Colophon  
The products described in this document are designed, developed and manufactured as contemplated for general use, including without  
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as  
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the  
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,  
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for  
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to  
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor  
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design  
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal  
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under  
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,  
the prior authorization by the respective government entity will be required for export of those products.  
Trademarks and Notice  
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under  
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this  
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,  
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any  
damages of any kind arising out of the use of the information in this document.  
Copyright © 2005–2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations  
thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.  
34  
S25FL032A  
S25FL032A_00_C0 September 1, 2006