Ordering Information
Standard Products
Spansion standard products are available in several packages and operating
ranges. The order number (Valid Combination) is formed by a combination of the
elements below.
S29AL016M
90
T
A
I
01
2
PACKING TYPE
0
2
3
= Tray
= 7” Tape & Reel
= 13” Tape & Reel
ADDITIONAL ORDERING OPTIONS
01
R1
02
R2
=
=
=
=
x8/x16,
x8/x16,
x8/x16,
x8/x16,
V
CC
=
V
CC
=
V
CC
=
V
CC
=
2.7–3.6 V,
3.0–3.6 V,
2.7–3.6 V,
3.0–3.6 V,
top boot sector device
top boot sector device
bottom boot sector device
bottom boot sector device
TEMPERATURE RANGE
I
= Industrial (–40
°
C to +85
°
C)
PACKAGE MATERIAL SET
A
F
= Standard
= Pb-free
PACKAGE TYPE
T
B
F
= Thin Small Outline Package (TSOP) Standard Pinout
= Fine-Pitch Ball Grid Array (BGA)
= Fortified Ball Grid Array (BGA)
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29AL016M
16 Megabit (2M x 8-Bit/1M x 16-Bit) MirrorBit
TM
Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations
for TSOP Packages
S29AL016M90
S29AL016M10
TAI
TFI
01
R1
02
R2
Valid Combinations for BGA Packages
Package
TS048
Order Number
S29AL016M90
S29AL016M10
BAI
BFI
FAI
FFI
01
R1
02
R2
Package
FBA048
LAA064
Note:
Characters 1-16 of the OPN represent the TSOP
package marking. For example, the package marking for
OPN S29AL016M90TAI010 is “S29AL016M90TAI01”
Note:
Characters 4-16 of the OPN represent the BGA pack-
age marking. For example the package marking for OPN
S29AL016M90BAI010 is “AL016M90BAI01”
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this
device. Consult your local sales office to confirm availability of specific valid com-
binations and to check on newly released combinations.
April 21, 2004 S29AL016M_00A4
S29AL016M
10
SPANSION [ SPANSION ]
