P r e l i m i n a r y
Connection Diagrams
63-Ball Fine-Pitch BGA
Top View, Balls Facing Down
A8
NC*
A7
NC*
B8
NC*
B7
NC*
C7
A13
C6
A9
C5
WE#
C4
D7
A12
D6
A8
D5
RESET#
D4
E7
A14
E6
A10
E5
A21
E4
A18
E3
A6
E2
A2
F7
A15
F6
A11
F5
A19
F4
A20
F3
A5
F2
A1
G7
A16
G6
DQ7
G5
DQ5
G4
DQ2
G3
DQ0
G2
A0
H7
J7
K7
V
SS
K6
DQ6
K5
DQ4
K4
DQ3
K3
DQ1
K2
V
SS
L8
NC*
L7
NC*
M8
NC*
M7
NC*
BYTE#
1
DQ15/A-1
H6
DQ14
H5
DQ12
H4
DQ10
H3
DQ8
H2
CE#
J6
DQ13
J5
V
CC
J4
DQ11
J3
DQ9
J2
OE#
RY/BY# WP#/ACC
C3
A7
A2
NC*
A1
NC*
B1
NC*
C2
A3
D3
A17
D2
A4
L2
NC*
L1
M2
NC*
M1
NC*
* Balls are shorted together via the substrate but not connected to the die.
NC*
Notes:
1. Ball H7 is V
IO
on S29GL064M (model R5).
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
April 30, 2004 S29GLxxxM_00A5
S29GLxxxM MirrorBit
TM
Flash Family
13
SPANSION [ SPANSION ]
