P r e l i m i n a r y
Connection Diagrams
For S29GL064M (model R0) only.
63-Ball Fine-Pitch BGA
Top View, Balls Facing Down
A8
NC*
A7
NC*
B8
NC*
B7
NC*
C7
A14
C6
A9
C5
WE#
C4
RY/BY#
C3
A7
D7
A13
D6
A8
D5
RESET#
D4
ACC
D3
A18
D2
A4
E7
A15
E6
A11
E5
A22
E4
NC
E3
A6
E2
A2
F7
A16
F6
A12
F5
NC
F4
NC
F3
A5
F2
A1
G7
A17
G6
A19
G5
DQ5
G4
DQ2
G3
DQ0
G2
A0
H7
NC
H6
A10
H5
NC
H4
DQ3
H3
NC
H2
CE#
J7
A20
J6
DQ6
J5
V
CC
J4
V
IO
J3
NC
J2
OE#
K7
V
SS
K6
DQ7
K5
DQ4
K4
A21
K3
DQ1
K2
V
SS
L8
NC*
L7
NC*
M8
NC*
M7
NC*
A2
NC*
A1
NC*
B1
NC*
C2
A3
L2
NC*
L1
M2
NC*
M1
NC*
* Balls are shorted together via the substrate but not connected to the die.
NC*
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
14
S29GLxxxM MirrorBit
TM
Flash Family
S29GLxxxM_00A5 April 30, 2004