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S29GL064N90TFI060 参数 Datasheet PDF下载

S29GL064N90TFI060图片预览
型号: S29GL064N90TFI060
PDF下载: 下载PDF文件 查看货源
内容描述: 64兆, 32兆3.0伏只页面模式闪存设有110纳米的MirrorBit工艺技术 [64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology]
分类和应用: 闪存存储内存集成电路光电二极管
文件页数/大小: 79 页 / 3123 K
品牌: SPANSION [ SPANSION ]
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Data
She et
6.
Ordering Information–S29GL032N
S29GL032N Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
S29GL032N
90
T
A
I
01
0
PACKING TYPE
0 = Tray
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
MODEL NUMBER
01 = x8/x16, V
CC
= V
IO
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
IL
protects highest addressed sector
02 = x8/x16, V
CC
= V
IO
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
IL
protects lowest addressed sector
03 = x8/x16, V
CC
= 2.7 – 3.6 V, Top boot sector, WP#/ACC = V
IL
protects top two addressed sectors
04 = x8/x16, V
CC
= 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = V
IL
protects bottom two addressed sectors
V1 = x8/x16, V
CC
= 2.7 – 3.6 V, V
IO
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
IL
protects highest addressed
sector
V2 = x8/x16, V
CC
= 2.7 – 3.6 V, V
IO
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
IL
protects lowest addressed sector
TEMPERATURE RANGE
I = Industrial (–40°C to +85°C)
PACKAGE MATERIAL SET
A = Standard
F = Pb-Free
PACKAGE TYPE
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F = Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
DEVICE NUMBER/DESCRIPTION
S29GL032N
32 Megabit Page-Mode Flash Memory
Manufactured using 110 nm MirrorBit
®
Process Technology, 3.0 Volt-only Read, Program, and Erase
Table 6.1
S29GL032N Ordering Options
S29GL032N Valid Combinations
Device
Number
Speed
Option
90
TFI
11
90
FFI
S29GL032N
11
TFI
90
BFI
FFI
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in
Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering
part number.
3. BGA package marking omits leading
S29
and packing type designator
from ordering part number.
4. Contact local sales for availability for Leaded lead-frame parts.
03, 04
V1, V2
V1, V2
01, 02
0,2,3
TS048
VBK048
LAA064
TSOP
Fine-Pitch BGA
Fortified BGA
LAA064
Fortified BGA
Package, Material,
& Temperature Range
Model
Number
01, 02
TS056
TSOP
Packing
Type
Package Description
(Notes)
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this
device. Consult your local sales office to confirm availability of specific valid
combinations and to check on newly released combinations.
November 16, 2007 S29GL-N_01_09
S29GL-N MirrorBit
®
Flash Family
15