Data
Sheet
Figure 5.2
TSB084 Physical Dimensions
D
0.15 C
(2X)
10
9
8
7
A
D1
eD
SE
7
E
eE
6
5
4
3
2
1
L
J
H
G
F
E
D
C B
A
E1
INDEX MARK
PIN A1
CORNER
10
M
K
B
7
TOP VIEW
0.15 C
(2X)
SD
PIN A1
CORNER
BOTTOM VIEW
A A2
A1
84X
0.15
0.08
0.20 C
6
SIDE VIEW
b
M
M
C A B
C
C
0.08 C
NOTES:
PACKAGE
JEDEC
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
φb
eE
eD
SD / SE
0.35
TSB 084
N/A
11.60 mm x 8.00 mm
PACKAGE
MIN
---
0.17
0.81
NOM
---
---
---
11.60 BSC.
8.00 BSC.
8.80 BSC.
7.20 BSC.
12
10
84
0.40
0.80 BSC
0.80 BSC
0.40 BSC
0.45
MAX
1.20
---
0.97
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
9.
8.
7
6
NOTE
2.
3.
4.
5.
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
e REPRESENTS THE SOLDER BALL GRID PITCH.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
A2,A3,A4,A5,A6,A7,A8,A9
DEPOPULATED SOLDER BALLS
B1,B10,C1,C10,D1,D10
E1,E10,F1,F10,G1,G10
H1,H10,J1,J10,K1,K10,L1,L10
M2,M3,M4,M5,M6,M7,M8,M9
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3439 \ 16-038.22 \ 01.04.05
6
S71PL-N MirrorBit
TM
MCPs
S71PL-N_00_A9 December 8, 2006
SPANSION [ SPANSION ]
