A d v a n c e
I n f o r m a t i o n
Physical Dimensions
TLA064—64-ball Fine-Pitch Ball Grid Array (FBGA)
8 x 11.6 mm Package
D
0.15 C
(2X)
10
9
8
7
A
D1
eD
SE
7
E
eE
6
5
4
3
2
1
L
J
H
G
F
E
D
C B
A
E1
INDEX MARK
PIN A1
CORNER
10
M
K
B
7
TOP VIEW
0.15 C
(2X)
SD
PIN A1
CORNER
BOTTOM VIEW
A A2
A1
64X
0.15
0.08
0.20 C
6
SIDE VIEW
b
M C A B
M C
C
0.08 C
NOTES:
PACKAGE
JEDEC
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
φb
eE
eD
SD / SE
0.35
TLA 064
N/A
11.60 mm x 8.00 mm
PACKAGE
MIN
---
0.17
0.81
NOM
---
---
---
11.60 BSC.
8.00 BSC.
8.80 BSC.
7.20 BSC.
12
10
64
0.40
0.80 BSC.
0.80 BSC
0.40 BSC.
0.45
MAX
1.20
---
0.97
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
9.
8.
7
6
NOTE
2.
3.
4.
5.
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
e REPRESENTS THE SOLDER BALL GRID PITCH.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
A2,A3,A4,A5,A6,A7,A8,A9
DEPOPULATED SOLDER BALLS
B1,B2,B3,B4,B7,B8,B9,B10
C1,C2,C9,C10,D1,D10,E1,E10,
F1,F5,F6,F10,G1,G5,G6,G10
H1,H10,J1,J10,K1,K2,K9,K10
L1,L2,L3,L4,L7,L8,L9,L10
M2,M3,M4,M5,M6,M7,M8,M9
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3352 \ 16-038.22a
December 23, 2004 S71PL129Jxx_00_A5
11
SPANSION [ SPANSION ]
