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S71WS256NC0BAWA70 参数 Datasheet PDF下载

S71WS256NC0BAWA70图片预览
型号: S71WS256NC0BAWA70
PDF下载: 下载PDF文件 查看货源
内容描述: 堆叠式多芯片产品( MCP ) [Stacked Multi-Chip Product (MCP)]
分类和应用:
文件页数/大小: 188 页 / 3789 K
品牌: SPANSION [ SPANSION ]
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S71WS-Nx0 Based MCPs
Stacked Multi-Chip Product (MCP)
128/256/512 Megabit (32M/16M x 16 bit) CMOS
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with
pSRAM Type 4
Data Sheet
ADVANCE
INFORMATION
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. Each product described
herein may be designated as Advance Information, Preliminary, or Full
Production. See
for definitions.
Publication Number
S71WS-N_01
Revision
A
Amendment
4
Issue Date
September 15, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.