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S71WS256NC0BAWA70 参数 Datasheet PDF下载

S71WS256NC0BAWA70图片预览
型号: S71WS256NC0BAWA70
PDF下载: 下载PDF文件 查看货源
内容描述: 堆叠式多芯片产品( MCP ) [Stacked Multi-Chip Product (MCP)]
分类和应用:
文件页数/大小: 188 页 / 3789 K
品牌: SPANSION [ SPANSION ]
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S71WS-Nx0 Based MCPs
Stacked Multi-Chip Product (MCP)
128/256/512 Megabit (32M/16M x 16 bit) CMOS
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with
pSRAM Type 4
ADVANCE
INFORMATION
General Description
The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists
of the following items:
One or more flash memory die
pSRAM Type 4—Compatible pSRAM
The products covered by this document are listed in the table below. For details about their spec-
ifications, please refer to the individual constituent datasheet for further details.
Device
S71WS512ND0
S71WS256ND0
S71WS256NC0
S71WS128NC0
Flash Density
512 Mb
256
Mb
128
Mb
64
Mb
128 Mb
pSRAM Density
64 Mb
32 Mb
16 Mb
Distinctive Characteristics
MCP Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speed: 54 MHz, 66 MHz
Package
— 8 x 11.6 mm, 9 x 12 mm
Operating Temperature
— Wireless, –25° C to +85° C
Publication Number
S71WS-N_01
Revision
A
Amendment
4
Issue Date
September 15, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.