欢迎访问ic37.com |
会员登录 免费注册
发布采购

SST37VF020-70-3C-NHE 参数 Datasheet PDF下载

SST37VF020-70-3C-NHE图片预览
型号: SST37VF020-70-3C-NHE
PDF下载: 下载PDF文件 查看货源
内容描述: 512千位/ 1兆位/ 2兆位/ 4兆位( X8 )许多时间内可编程Flash [512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit (x8) Many-Time Programmable Flash]
分类和应用: 内存集成电路
文件页数/大小: 18 页 / 216 K
品牌: SST [ SILICON STORAGE TECHNOLOGY, INC ]
 浏览型号SST37VF020-70-3C-NHE的Datasheet PDF文件第1页浏览型号SST37VF020-70-3C-NHE的Datasheet PDF文件第3页浏览型号SST37VF020-70-3C-NHE的Datasheet PDF文件第4页浏览型号SST37VF020-70-3C-NHE的Datasheet PDF文件第5页浏览型号SST37VF020-70-3C-NHE的Datasheet PDF文件第6页浏览型号SST37VF020-70-3C-NHE的Datasheet PDF文件第7页浏览型号SST37VF020-70-3C-NHE的Datasheet PDF文件第8页浏览型号SST37VF020-70-3C-NHE的Datasheet PDF文件第9页  
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Many-Time Programmable Flash
SST37VF512 / SST37VF010 / SST37VF020 / SST37VF040
Data Sheet
Byte-Program Operation
The SST37VF512/010/020/040 are programmed by using
an external programmer. The programming mode is acti-
vated by asserting 11.4-12V on OE# pin and V
IL
on CE#
pin. The device is programmed using a single pulse (WE#
pin low) of 15 µs per byte. Using the MTP programming
algorithm, the Byte-Program process continues byte-by-
byte until the entire chip has been programmed. Refer to
gram.
Product Identification Mode
The Product Identification mode identifies the devices as
SST37VF512,
SST37VF010,
SST37VF020,
and
SST37VF040 and manufacturer as SST. This mode may
be accessed by the hardware method. To activate this
mode, the programming equipment must force V
H
(11.4-
12V) on address A
9
. Two identifier bytes may then be
sequenced from the device outputs by toggling address
line A
0
. For details, see Table 3 for hardware operation.
TABLE 1: Product Identification
Chip-Erase Operation
The only way to change a data from a “0” to “1” is by
electrical erase that changes every bit in the device to
“1”. The SST37VF512/010/020/040 use an electrical
Chip-Erase operation. The entire chip can be erased
in 100 ms (WE# pin low). In order to activate erase
mode, the 11.4-12V is applied to OE# and A
9
pins
while CE# is low. All other address and data pins are
“don’t care”. The falling edge of WE# will start the
Chip-Erase operation. Once the chip has been erased,
all bytes must be verified for FFH. Refer to Figure 10
for the flowchart and Figure 6 for the timing diagram.
Manufacturer’s ID
Device ID
SST37VF512
SST37VF010
SST37VF020
SST37VF040
Address
0000H
0001H
0001H
0001H
0001H
Data
BFH
C4H
C5H
C6H
C2H
T1.2 1151
Design Considerations
The SST37VF512/010/020/040 should have a 0.1 µF
ceramic high frequency, low inductance capacitor con-
nected between V
DD
and GND. This capacitor should be
placed as close to the package terminals as possible.
OE# and A
9
must remain stable at V
H
for the entire dura-
tion of an Erase operation. OE# must remain stable at V
H
for the entire duration of the Program operation.
X-Decoder
SuperFlash
Memory
Memory Address
Address Buffer
Y-Decoder
CE#
OE#
A9
WE#
Control Logic
I/O Buffers
DQ7 - DQ0
1151 B1.1
FIGURE 1: Functional Block Diagram
©2006 Silicon Storage Technology, Inc.
S71151-07-000
8/06
2