S93WD662/S93WD663
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias .................................................................................................................................... –55°C to +125°C
Storage Temperature ......................................................................................................................................... –65°C to +150°C
Voltage on any Pin with Respect to Ground
(1)
............................................................................................. –2.0V to +V
CC
+2.0V
V
CC
with Respect to Ground .................................................................................................................................. –2.0V to +7.0V
Package Power Dissipation Capability (Ta = 25°C) ............................................................................................................. 1.0W
Lead Soldering Temperature (10 secs) .............................................................................................................................. 300°C
Output Short Circuit Current
(2)
........................................................................................................................................... 100 mA
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to
any absolute maximum rating for extended periods may affect device performance and reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature
Commercial
Industrial
Min
0°C
-40°C
Max
+70°C
+85°C
2013 PGM T7 1.0
RELIABILITY CHARACTERISTICS
Symbol
N
END(3)
T
DR(3)
V
ZAP(3)
I
LTH(3)(4)
Parameter
Endurance
Data Retention
ESD Susceptibility
Latch-Up
Min.
100,000
100
2000
100
Max.
Units
Cycles/Byte
Years
Volts
mA
2013 PGM T2 1.1
D.C. OPERATING CHARACTERISTICS
(over recommended operating conditions unless otherwise specified)
Limits
Symbol
I
CC
Parameter
Power Supply Current
(Operating)
Power Supply Current
(Standby)
Input Leakage Current
Output Leakage Current
(Including ORG pin)
Input Low Voltage
Input High Voltage
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Output Low Voltage
Output High Voltage
-0.1
2
0
V
CC
X0.7
2.4
0.2
V
CC
-0.2
Min.
Typ.
Max.
3
Units
mA
Test Conditions
DI = 0.0V, f
SK
= 1MHz
V
CC
= 5.0V, CS = 5.0V,
Output Open
CS = 0V
Reset Outputs Open
V
IN
= 0V to V
CC
V
OUT
= 0V to V
CC
,
CS = 0V
4.5V-V
CC
<5.5V
1.8V-V
CC
<2.7V
4.5V-V
CC
<5.5V
I
OL
= 2.1mA
I
OH
= -400µA
1.8V-V
CC
<2.7V
I
OL
= 1mA
I
OH
= -100µA
2013 PGM T3 1.1
I
SB
I
LI
I
LO
V
IL1
V
IH1
V
IL2
V
IH2
V
OL1
V
OH1
V
OL2
V
OH2
50
2
10
0.8
V
CC
+1
V
CC
X0.2
V
CC
+1
0.4
µA
µA
µA
V
V
V
V
V
V
V
V
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is V
CC
+0.5V, which may overshoot to V
CC
+2.0V for periods of less than 20 ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to V
CC
+1V.
7
2013 2.1 8/2/00
SUMMIT [ SUMMIT MICROELECTRONICS, INC. ]
