FERRITE CHIP INDUCTORS
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
3.0
1.0
L201610 SERIES
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150°C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350°C tip temperature (max)
f) Limit soldering time to 4~5 secs.
c) Never contact the ceramic with the iron tip
Preheating
Soldering
Natural
cooling
TEMPERATURE °C
20 ~ 40s
260
217
200
150
60~150s
60~180s
25
480s max.
Time (sec)
Reflow 3 times max.
Figure 1. Re-flow Soldering (Pb Free)
Preheating
Soldering
4~5 sec
(max.)
1.6
TEMPERATURE °C
Natural
cooling
350
330
150
Over 1min.
Gradual
Cooling
Figure 2. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
