TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
TAOS050K
−
OCTOBER 2007
MECHANICAL DATA
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The photodiode area is typically 1.02 mm
2
for the TSL250RD and TSL260RD,
and is typically 0.514 mm
2
for the TSL251RD and TSL261RD.
PACKAGE D
NOTE B
2.12
+
0.250
3.00
+
0.250
PLASTIC SMALL-OUTLINE
TOP VIEW
BOTTOM VIEW
PIN 1
PIN 1
6
y
1.27
8
y
0.510
0.330
SIDE VIEW
j
2.8 TYP
CLEAR WINDOW
END VIEW
0.50
0.25
455
0.88 TYP TOP OF
SENSOR DIE
A
1.75
1.35
4.00
3.80
6.20
5.80
5.00
4.80
5.3
MAX
DETAIL A
0.25
0.19
Pb
NOTES: A.
B.
C.
D.
1.27
0.41
0.25
0.10
All linear dimensions are in millimeters.
The center of the photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
This drawing is subject to change without notice.
Figure 10. Package D — Plastic Small Outline IC Packaging Configuration
The
LUMENOLOGY
r
Company
Copyright
E
2007, TAOS Inc.
r
r
www.taosinc.com
7
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
