TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
TAOS050K
−
OCTOBER 2007
MANUFACTURING INFORMATION
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
Table 1. TSL2xxRD Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above T
peak
−10°C
Peak temperature in reflow
Temperature gradient in cooling
t
soak
t
1
t
2
t
3
T
peak
REFERENCE
TSL2xxRD
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C (−0°C/+5°C)
Max
−5°C/sec
T
peak
Not to scale — for reference only
T
3
T
2
T
1
Temperature (5C)
Time (sec)
t
soak
t
3
t
2
t
1
Figure 12. TSL2xxRD Solder Reflow Profile Graph
The
LUMENOLOGY
r
Company
r
r
Copyright
E
2007, TAOS Inc.
www.taosinc.com
9
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
