1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88669
01
X_
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
Generic number 1/
Circuit function
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
2048 X 9 FIFO
Access time
80 ns
65 ns
50 ns
40 ns
30 ns
20 ns
25 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
Descriptive designator
GDIP1-T28 or CDIP2-T28
CDIP3-T28 or GDIP4-T28
CQCC1-N32
GDFP2-F28
Terminals
28
28
32
28
Package style
Dual-in-line package
Dual-in-line package
Rectangular leadless chip carrier
Flat package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc
DC voltage applied to outputs in high-Z state ........................................ -0.5 V dc to +7.0 V dc
DC input voltage range .......................................................................... -0.5 V dc to +7.0 V dc 2/
DC output current .................................................................................. 20 mA
Maximum power dissipation 3/ .............................................................. 1.0 W
Lead temperature (soldering, 10 seconds)............................................. +260°C
Thermal resistance, junction-to-case (Θ
JC
): ........................................... See MIL-STD-1835
Junction temperature (T
J
) 4/ ................................................................. +150°C
Storage temperature range .................................................................... -65°C to +150°C
Temperature under bias......................................................................... -55°C to +125°C
1/
2/
3/
4/
Generic numbers are listed on the Standard Microcircuit Source Approval Bulletin at the end of this document and will also
be listed in MIL-HDBK-103.
1.5 V undershoots are allowed for 10 ns once per cycle.
Must withstand the added P
D
due to short circuit test (e.g., I
OS
).
Maximum junction temperature may be increased to +175°C during burn-in and steady-state life.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88669
SHEET
E
2
TEMIC [ TEMIC SEMICONDUCTORS ]
