TC1201
REV5_20070502
CHIP DIMENSIONS
430 12
D
D
250 12
S
S
S
G
G
Units: Micrometers
Chip Thickness: 100
Gate Pad: 55 x 50
Drain Pad: 55 x 50
Source Pad: 55 x 65
TYPICAL SCATTERING PARAMETERS (TA=25 °C) VDS = 4 V, IDS = 25 mA
0
.
1
0
9
Mag Max
0.15
Swp Max
18 GHz
8
Swp Max
18GHz
5
7
.
1
0
6
0
6
0
.
0
0
1
5
.
2
2
5
4
0
4
.
1
3
5
0
.
0
3
S11
0
3
0
.
4
1
0
.
5
0
2
.
5
0
5
1
0
.
0
1
1
6
0
.
0
1
5
2
4
6
8
0
.
1
0
0
.
3
0 0
. .
4 5
.
.
.
.
.
0
0
0
0
0
0
2
-180
0
.
0
1
-
-
1
5
5
6
1
-
2
.
0
0
.
-
5
-
S12
0
-
3
.
4
0
-
0
5
0
1
.
-
4
3
-
.
-
4
0
5
5
-
0
3
1
.
6
-
-
2
.
6
0
0
-
0
8
2
-
7
5
0
.
1
-
-
-
.
1
5
Swp Min
2GHz
0.075
Per Div
Swp Min
2 GHz
-
0
-
0
9
0
1
-
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
2 / 6
Fax: 886-6-5051602
TRANSCOM [ TRANSCOM, INC. ]
