TC1201
REV5_20070502
SCHEMATIC
TOM2 MODEL PARAMETERS
Parameters
VTO
ALPHA
BETA
GAMMA
DELTA
Q
Parameters
-0.757 V
3.92
VMAX
CGD
CGS
CDS
RIS
0.5
V
0.032 pF
1.7929 pF
0.097 pF
0.161
Lg
Rg
Cgd
Ld
Rd
Rid
Id
0.0509
0.3815
0.987
7.121 Ohm
0.001 Ohm
Cgs
Ris
Rdb
Cbs
RID
Cds
NG
0.1
VBR
RDB
CBS
9
V
ND
0.01
173.9 Ohm
0.0266 pF
25 °C
0.0005 nH
0.0278 nH
0.0243 nH
1
TAU
5.098 ps
Rs
Ls
RG
2.205 Ohm TNOM
0.898 Ohm LS
1.631 Ohm LG
1E-11 mA LD
RD
RS
IS
N
1
1
AFAC
VBI
V
V
NFING
1
VDELTA
0.2
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C 5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
6 / 6
Fax: 886-6-5051602
TRANSCOM [ TRANSCOM, INC. ]
