Product Brief
AGR18125E
125 W, 1.805 GHz—1.880 GHz, LDMOS RF Power Transistor
Test Circuit Illustrations for AGR18125E
+
C19 C20 C21
V
GG
C26
R3
+
C14
+
R2
C13
C12
C11
C10
C9
C8
Z13
R1
FB1
Z24
C22
C23
C24
C25
V
DD
Z21
Z20
Z19
Z22
C17
C18
Z23
RF OUTPUT
Z1
RF INPUT
C28
Z2
Z4
C27
Z5
C1
Z6
Z7
Z8
Z9
Z10
Z18
Z17
Z16
Z3
R4
C2
C3
Z14
DUT
Z15
C16
1
3
C15
Z11
Z12
2
C5
C4
PINS:
1. DRAIN
2. GATE
3. SOURCE
A. Schematic
Parts List:
Murata
®
chip
capacitor:
C12, C24: 0.01 µF
GRM40X7R103K100AL.
0603 chip
capacitor:
C10, C22: 220 pF.
Sprague
®
tantalum
chip capacitor:
C14, C15, C26:
22 µF, 35 V.
Kreger
®
ferrite bead:
FB1 2743D19447.
Kemet
®
chip capacitor:
C13, C25 0.10 µF
C1206C104KRAC7800.
Vitramon
®
chip
capacitor:
C11, C23: 2200 pF,
VJ1206Y222KXA.
Taconic
®
ORCER RF-
35: board material, 1 oz.
copper, 30 mil thickness,
ε
r = 3.5.
Microstrip line: Z1 0.243 in. x 0.066 in.; Z2 0.050 in. x 0.066 in.; Z3 0.321 in. x 0.050 in.; Z4 0.047 in. x 0.066 in.; Z5 0.067 in. x 0.066 in.;
Z6 0.123 in. x 0.066 in.; Z7 0.050 in. x 0.066 in.; Z8 0.381 in. x 0.066 in.; Z9 0.896 in. x 0.150 in.; Z10 0.050 in. x 0.600 in.;
Z11 0.540 in. x 0.600 in.; Z12 0.050 in. x 0.600 in.; Z13 1.024 in. x 0.050 in.; Z14 0.093 in. x 0.500 in.; Z15 0.050 in. x 0.500 in.;
Z16 0.242 in. x 0.500 in.; Z17 0.050 in. x 0.500 in.; Z18 0.198 in. x 0.500 in.; Z19 0.446 x 0.100; Z20 0.095 in. x 0.066 in.;
Z21 0.050 in. x 0.066 in.; Z22 0.419 in. x 0.066 in.; Z23 0.745 in. x 0.066 in.; Z24 2.048 in. x 0.050 in.
ATC
®
chip capacitor: C5: 4.7 pF 100B4R7BW; C4, C18 3.9 pF 100B3R9BW; C6, C7: 12 pF 100B120JW; C16, C17: 9.1 pF 100B9R1BW;
C9, C21: 10 pF 100B100JW; C2: 47 pF 100A470JW; C3, C8, C19, C20: 47 pF 100B470JW; C1: 8.2 pF 100A8R2BW.
1206 size, 0.25 W, fixed film, chip resistors: R1 50
Ω,
RM73B2B500J; R2 47 kΩ RM73B2B473J; R3 1 kΩ RM73B2B103J;
R4 10
Ω
RM73B2B100J.
B. Component Layout
Figure 2. AGR18125E Test Circuit
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
