TGA2527-SM
Ku-Band Power Amplifier
Mechanical Information
Package Information and Dimensions
All dimensions are in millimeters.
This package is lead-free/RoHS-compliant with a copper alloy base (CDA194), and the plating material on the leads is 100%
matte Sn. It is compatible with both lead-free (maximum 260 °C reflow temperature) and tin-lead (maximum 245 °C reflow
temperature) soldering processes.
Preliminary Data Sheet: Rev - 11/21/11
© 2011 TriQuint Semiconductor, Inc.
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