TGA2527-SM
Ku-Band Power Amplifier
Mechanical Information (cont.)
Mounting Configuration
All dimensions are in millimeters (inches).
Notes:
1. A heatsink underneath the area of the PCB for the mounted device
is recommended for proper thermal operation.
2. Ground / thermal vias are critical for the proper performance of this device.
Vias have a final plated thru diameter of .40 mm (.016”).
.675
.675
Tape and Reel Information
Tape and reel specifications for this part are also available on the TriQuint website in the “Application Notes” section.
Standard T/R size = 500 pieces on a 7 x 0.5” reel.
CARRIER AND COVER TAPE DIMENSIONS
Size (in)
0.207
Size (mm)
5.25
Part
Cavity
Feature
Length
Width
Depth
Pitch
Symbol
A0
B0
K0
P1
0.207
0.043
0.315
5.25
1.10
8.00
Distance Between Centerline Cavity to Perforation
Length Direction
P2
F
0.079
0.217
2.00
5.50
Cavity to Perforation
Width Direction
Cover Tape
Carrier Tape
Width
Width
C
W
0.374
0.472
9.5
12.0
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Connecting the Digital World to the Global Network®
Preliminary Data Sheet: Rev - 11/21/11
Disclaimer: Subject to change without notice
© 2011 TriQuint Semiconductor, Inc.
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
