Advance Product Datasheet
April 6, 2006
TGA4819-SL
Mechanical Drawing
.207
.407
15
16
17
19
.350
.326
10
11
12
13
14
.175
9
18
.438
Orientation Mark
.024
.000
8
7
6
5
4
3
2
1
.000
.013
.412
.206
.235
.047
.087
.127
.167
.327
.367
.450
0.018"
0.018"
0.018"
0.018"
0.018"
0.018"
0.018"
0.020"
0.334"
Bond
Bond
Bond
Bond
Bond
Bond
Bond
Bond
Bond
Bond
Pad
Pad
Pad
Pad
Pad
Pad
Pad
Pad
Pad
Pad
#1
#2
#3
#4
#5
#6
#7
#8
#9
#10
N/C
N/C
N/C
N/C
N/C
VG
N/C
N/C
RF Out
N/C
0.025"
0.018"
0.018"
0.018"
0.018"
0.018"
0.018"
0.018"
0.020"
0.018"
x
x
x
x
x
x
x
x
x
x
0.041"
0.041"
0.041"
0.041"
0.041"
0.041"
0.041"
0.041"
0.018"
0.041"
Bond
Bond
Bond
Bond
Bond
Bond
Bond
Bond
Bond
Pad
Pad
Pad
Pad
Pad
Pad
Pad
Pad
Pad
#11
#12
#13
#14
#15
#16
#17
#18
#19
N/C
VD
N/C
N/C
N/C
VD_BYP
VCTRL
RF In
GND
x
x
x
x
x
x
x
x
x
0.041"
0.041"
0.041"
0.041"
0.041"
0.041"
0.041"
0.018"
0.187"
NOTES:
1. Maximize number of vias on attachment area of PCB for Bond Pad #19. This is required
electrical and thermal conduction
2. Pad sizes for RF input and output (#18, #9) are shown for soldermask opening. Solder
should not be applied outside of this area.
Dimensions:
Inches
Tolerances:
Length & Width: ±0.003"
Height: ±0.006"
Adjacent Pad to Pad Spacing: ±0.0002"
Pad Size: ±0.001"
Package Backside Material:
Material: RO4003 (0.008" thk) w/ 0.5oz Cu (0.0007" thk)
Plating: 100 - 350µin Ni underplate w/ 5 - 10µin Au overplate
TriQuint Semiconductor Texas : (972)994 8465
Fax (972)994 8504 Web: www.triquint.com
10
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