Advance Product Datasheet
April 6, 2006
TGA4819-SL
Assembly of a TGA4819-SL Package onto a Motherboard
Manual Assembly for Prototypes
1. Clean the motherboard with Acetone and rinse with alcohol and DI water. Allow the motherboard to fully dry.
2. Using a standard SN63 or lead-free solder paste, dispense solder paste dots of 5 to 15 mil in diameter to the
motherboard. Assure that there is a minimum of 5 mils and a maximum of 10 mils between the edge of each
solder paste area and the closest edge of the ground pad.
3. Manually place a TGA4819-SL on the motherboard with correct orientation and good alignment. The
alignment can be determined manually by centering the package on the motherboard. The RF traces (pin 1 and
pin 10) are located along the center horizontal axis of the package.
4. Reflow the assembly on a hot plate with the surface temperature of the plate near 230
o
C for 5 to 6 seconds
(for SnPb).
5. Let the assembly completely cool down.
This package has little or no tendency to self- align during the reflow.
6.
Clean the assembly with acetone and rinse with alcohol and DI water.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate
Activation Time and
Temperature
Time above Melting Point
Max Peak Temperature
Time within 5
°C
of Peak
Temperature
Ramp-down Rate
SnPb
3
°C/sec
60 – 120 sec @ 140 – 160
°C
60 – 150 sec
240
°C
10 – 20 sec
4 – 6
°C/sec
Pb Free
3
°C/sec
60 – 180 sec @ 150 – 200
°C
60 – 150 sec
260
°C
10 – 20 sec
4 – 6
°C/sec
CAUTION: The TGA4819-SL contains GaAs MMIC devices that are susceptible to damage from
Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
TriQuint Semiconductor Texas : (972)994 8465
Fax (972)994 8504 Web: www.triquint.com
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