Advance Product Information
June 30, 2004
TGA4915-EPU-CP
Assembly of a TGA4915-EPU-CP into a Module
Manual Assembly for Prototypes
1. Clean the module with Acetone. Rinse with alcohol and DI water. Allow the module to fully dry.
2. To improve the thermal and RF performance, we recommend attaching a heatsink to the bottom of the
package. If the TGA4915 is mounted to the heatsink with mounting screws, we recommend an indium
shim or other compliant material be inserted between the TGA4915 and the heatsink to reduce thermal
contact resistance due to air gaps. The TGA4915 may also be attached to the heatsink using SN63 solder
or any other Tin/Lead solder. The TGA4915 may also be mounted with DieMat DM6030HK conductive
epoxy or similar thermally and electrically conductive epoxy.
3. The DC and RF interconnects may be gold bondwires or gold ribbons. The RF interconnects should be
as short as possible. A minimum of two 1 mil wires are recommended for the RF Input, RF Output, Vg, and
Vd1 and Vd3. Six bondwires are recommended for Vd2 and Vd4.
ORDERING INFORMATION
PART
TGA4915-EPU-CP
PACKAGE STYLE
CARRIER PLATE
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
