TGA9083-EEU
3
120.0
115.5
112.0
104.5
97.9
89.5
89.2
86.0
4
5
168.4
MECHANICAL DRAWING
14.5
41.7
6
110.0
A
B
C
E
D
51.5
1
2
53.5
8.1
9
5.4
0.0
7
0.0
5.9
14.5
8
169.0
178.0
41.7
9.7
Units: millimeters (inches)
Thickness: 0,1016 (0.004) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad.
Chip size +/- 0,0508 (0.002)
Bond
Bond
Bond
Bond
Bond
Bond
Bond
pad #1
pad #2
pad #3
pad #4, #7
pad #5, #8
pad #6, #9
pads A,B,C,D,E
(RF Input)
(RF Output)
(-V
AGB
)
(-V
G
)
(V
D1
)
(V
D2
)
Center two bond wires equal distance from center line
Center two bond wires equal distance from center line
0,120 x 0,120 (.0047 x .0047)
0,120 x 0,120 (.0047 x .0047)
0,240 x 0,120 (.0094 x .0047)
0,275 x 0,340 (.0108 x .0134)
0,120 x 0,120 (.0047 x .0047)
9
TriQuint Semiconductor, Inc.
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
