TQP3M9009
High Linearity LNA Gain Block
Mechanical Information
Package Information and Dimensions
Markings:
Part number: 3M9009
Assembly code: ‘Y’ is last digit of part
manufacture year. ‘XXX’ is lot code.
3M9009
YXXX
PCB Mount Pattern
All dimensions are in millimeters (inches). Angles are in degrees.
Notes:
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. RF trace width depends upon the PC board material and construction.
4. Use 1 oz. Copper minimum.
Data Sheet: Rev G 12/27/11
© 2011 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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