13-16GHz High Power Amplifier
CHA6042
MMIC Outline & Bond Pads
Not to scale, dimensions are in millimeters
2
3
4
5
1
6
1.36
±0.35
1
9
8
7
2.34 ±0.35
Symbol
x-dim.
y-dim.
x-center
y-center
Bond Pad
(um)
100
100
100
(um)
200
100
100
(um)
115
(um)
835
1
2
RF input
Vd1
305
1255
1255
3
Vd2
470
Vg4
Vg3
Vg2
Vg1
Chip size : 2340µm +/-35µm x 1360µm +/- 35µm
Ref. : DSCHA6042218 - 06-Aug.-02
4/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09