W-band Mixer
Typical Assembly and RF Configuration
CHM2179a
In order to use acceptable wire bonding length, compatible with automatic
pick and place and wire bonding equipment, an external matching network is
proposed on low dielectric constant substrate.
50 Ohm
390
200
Er ~ 2.2
h = 0.127mm
630
200
390
4
5
6
11
10
9
8
7
3
2
250
150
420
390
50 Ohm
Example of integration using low dielectric constant substrate : Er=2.2,
heigh=0.127mm (dimensions are in µm)
Ref. : DSCH21790192 - 22-Jun-00
5/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
L ~ 0.25nH
Er ~ 2.2
h = 0.127mm
390
860
120 100
1
100 120
L ~ 0.25nH
320
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
