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MCM1012B 参数 Datasheet PDF下载

MCM1012B图片预览
型号: MCM1012B
PDF下载: 下载PDF文件 查看货源
内容描述: [Powerful components with composite co-fired material to solve EMI problem for high speed differential signal transmission line as USB, and LVDS, without distortion to high speed signal transmission MIPI, MHL serial interface in mobile device.]
分类和应用:
文件页数/大小: 6 页 / 1187 K
品牌: UNSEMI [ UN Semiconducctor INC ]
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LOW PROFILE TYPE (Chip Common Mode Filter) Engineering Specification
MCM1012B Series
REEL DIMENSIONS
STANDARD QUANTITY FOR PACKAGING
Packaging style : Taping
Reel packaging quantity : 4000 pcs/reel
Inner box : 5 reel/inner box
RECOMMENDED SOLDERING CONDITIONS
GENERAL TECHNICAL DATA
Opertation temperatur range : -40℃ ~ +85℃
Storage Condition : Less than 40℃ and 70% RH
Storage Time: 6 months Max.
Soldering method: Reflow or Wave Soldering
UN Semiconductor Co., Ltd.
Revision December 18, 2014
@ UN Semiconductor Co., Ltd.
2014
5/6
Specifications are subject to change without notice.