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W3E32M72S-250BI 参数 Datasheet PDF下载

W3E32M72S-250BI图片预览
型号: W3E32M72S-250BI
PDF下载: 下载PDF文件 查看货源
内容描述: 32Mx72 DDR SDRAM [32Mx72 DDR SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 19 页 / 669 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
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White Electronic Designs
A simple algorithm for meeting both refresh and DLL
requirements is to apply NOPs for t
XSNR
time, then a DLL
Reset and NOPs for 200 additional clock cycles before
applying any other command.
* Self refresh available in commercial and industrial temperatures only.
W3E32M72S-XBX
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on V
CC
, V
CCQ
Supply relative to Vss
Voltage on I/O pins relative to Vss
Operating Temperature T
A
(Mil)
Operating Temperature T
A
(Ind)
Storage Temperature, Plastic
-1 to 3.6
-0.5V to V
CCQ
+0.5V
-55 to +125
-40 to +85
-55 to +125
Unit
V
V
°C
°C
°C
NOTE:Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
CAPACITANCE (NOTE 13)
Parameter
Input Capacitance: CK/CK#
Addresses, BA
0-1
Input Capacitance
Input Capacitance: All other input-only pins
Input/Output Capacitance: I/Os
Symbol
C
I1
CA
C
I2
C
IO
Max
8
32
10
12
Unit
pF
pF
pF
pF
BGA THERMAL RESISTANCE
Description
Junction to Ambient (No Airflow)
Junction to Ball
Junction to Case (Top)
Symbol
Theta JA
Theta JB
Theta JC
Max
13.7
10.3
4.6
Units
°C/W
°C/W
°C/W
Notes
1
1
1
Refer to "PBGA Thermal Resistance Correlation" Application Note at www.whiteedc.com in the application notes section for modeling conditions.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 2
10
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com