White Electronic Designs
PACKAGE DIMENSION: 119 BUMP PBGA
1.90 (0.075)
MAX
WED2ZL361MV
7.62 (0.300)
TYP
A
B
C
D
E
F
G
17.00 (0.669) TYP
A1
CORNER
1.27 (0.050)
TYP
23.00 (0.905)
TYP
20.32 (0.800)
TYP
H
J
K
L
M
N
P
R
T
U
1.27 (0.050) TYP
0.711 (0.028)
MAX
NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
Commercial Temp Range (0°C to 70°C)
Part Number
WED2ZL361MV35BC
WED2ZL361MV38BC
WED2ZL361MV42BC
WED2ZL361MV50BC
Configuration
1M x 36
1M x 36
1M x 36
1M x 36
t
CD
(ns)
3.5
3.8
4.2
5.0
Clock
(MHz)
166
150
133
100
Industrial Temp Range (-40°C to +85°C)
Part Number
WED2ZL361MV35BI
WED2ZL361MV38BI
WED2ZL361MV42BI
WED2ZL361MV50BI
Configuration
1M x 36
1M x 36
1M x 36
1M x 36
t
CD
(ns)
3.5
3.8
4.2
5.0
Clock
(MHz)
166
150
133
100
June 2004
Rev. 3
12
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
