W25Q16V
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 208-mil (Package Code SS)
SYMBOL
A
A1
A2
b
C
D
D1
E
E1
e
H
L
y
θ
MILLIMETERS
MIN
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
-
0°
INCHES
MAX
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.010
8°
NOM
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
1.27 BSC
7.90
0.65
-
-
MIN
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
-
0°
NOM
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.050 BSC
0.311
0.026
-
-
MAX
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
- 53 -
Publication Release Date: October 7, 2009
Revision E
θ
WINBOND [ WINBOND ]
