WM2617
Production Data
PACKAGE DIMENSIONS
D: 8 PIN SOIC 3.9mm Wide Body
DM009.B
e
B
8
5
E
H
1
4
L
D
h x 45
o
A
A1
-C-
α
C
0.10 (0.004)
SEATING PLANE
Symbols
A
A
1
B
C
D
e
E
h
H
L
α
REF:
Dimensions
(mm)
MIN
MAX
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
4.80
5.00
1.27 BSC
3.80
4.00
0.25
0.50
5.80
6.20
0.40
1.27
o
o
0
8
Dimensions
(Inches)
MIN
MAX
0.0532
0.0688
0.0040
0.0098
0.0130
0.0200
0.0075
0.0098
0.1890
0.1968
0.050 BSC
0.1497
0.1574
0.0099
0.0196
0.2284
0.2440
0.0160
0.0500
o
o
0
8
JEDEC.95, MS-012
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
WOLFSON MICROELECTRONICS LTD
PD Rev 1.1 October 2000
10
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
