R
Virtex™ 2.5 V Field Programmable Gate Arrays
Virtex Device/Package Combinations and Maximum I/O
Table 3: Virtex Family Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)
Package
CS144
TQ144
PQ240
HQ240
BG256
BG352
BG432
BG560
FG256
FG456
FG676
FG680
XCV50
94
XCV100
94
XCV150
XCV200
XCV300
XCV400
XCV600
XCV800 XCV1000
98
98
166
166
166
166
166
166
166
166
316
180
176
180
176
180
260
180
260
260
316
316
404
316
404
404
404
512
176
260
176
284
312
404
444
512
444
512
Virtex Ordering Information
Example:
XCV300 -6 PQ 240 C
Device Type
Temperature Range
C = Commercial (TJ = 0 C to +85 C)
I = Industrial (TJ = –40 C to +100 C)
Speed Grade
-4
-5
-6
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine-pitch Ball Grid Array
PQ = Plastic Quad Flat Pack
HQ = High Heat Dissipation QFP
TQ = Thin Quad Flat Pack
CS = Chip-scale Package
Figure 1: Virtex Ordering Information
DS003-1 (v2.5 ) April 2, 2001
Product Specification
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