Phycomp
Product specification
Surface-mount ceramic
multilayer capacitors
TESTS AND REQUIREMENTS
Table 2
Test procedures and requirements
IEC
60068-2
TEST
METHOD
Class 2, Z5U
25/50 V
IEC
60384-10/
CECC 32 100
CLAUSE
4.4
TEST
PROCEDURE
REQUIREMENTS
mounting
the capacitors may be
mounted on printed-circuit
boards or ceramic
substrates by applying
wave soldering, reflow
soldering (including vapour
phase soldering) or
conductive adhesive
any applicable method
using
×10
magnification
f = 1 kHz; measuring
voltage 0.5 V
rms
at 25
°C
f = 1 kHz; measuring
voltage 0.5 V
rms
at 25
°C
at U
R
(DC) for 1 minute
2.5
×
U
R
for one minutes
max.
10 to 85
°C
a force of 5 N applied for
10 s to the line joining the
terminations and in a plane
parallel to the substrate
mounted in accordance
with CECC 32 100,
paragraph 4.4
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig 340 mm
no visible damage
4.5
4.6.1
visual inspection and
dimension check
capacitance
in accordance with
specification
within specified tolerance
measured 1000 hours after
date of manufacture
in accordance with
specification
in accordance with
specification
no breakdown or flashover
∆C/C: +22%
to
−56%
at 25
°C
no visible damage
4.6.2
4.6.3
4.6.4
4.7.1
4.8
tan
δ
insulation resistance
voltage proof
temperature
characteristic
adhesion
4.9
bond strength of
plating on end face
no visible damage
∆C/C: ±30%
2003 Jul 08 Rev.6
8
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