Phycomp
Product specification
Surface-mount ceramic
multilayer capacitors
IEC
60384-10/
CECC 32 100
CLAUSE
4.10
IEC
60068-2
TEST
METHOD
Tb
Class 2, Z5U
25/50 V
TEST
PROCEDURE
260
±5 °C
for 10
±0.5
s
in a static solder bath
REQUIREMENTS
resistance to
soldering heat
the terminations shall be well
tinned after recovery
∆C/C: ±20%
tan
δ:
original specification
R
ins
: original specification
resistance to
leaching
260
±5 °C
for 30
±1
s
in a static solder bath
using visual enlargement of
×10,
dissolution of the
terminations shall not
exceed 10%
the terminations shall be
well tinned
4.11
Ta
solderability
zero hour test, and test
after storage
(20 to 24 months) in
original packing in normal
atmosphere;
unmounted chips
completely immersed for
2
±0.5
s in a solder bath
at 235
±5 °C
initialization:
150
°C
for 1 hour, recovery
48
±4
hours at 40
°C;
90 to 95% RH;
U
R
applied for 500 hours
initialization:
2
×
U
R
at 85
×
C for 1 hour
(initial value) is measured
after 48
±4
hours;
2
×
U
R
at 85
°C
for
42 days, recovery
48
±4
hours at
room temperature
4.14
Ca
damp heat
∆C/C: ±30%
tan
δ:
6% max.
R
ins
: 1000 MΩ or R
i
C
R
≥
100 s,
whichever is less
after 48 hours recovery:
∆C/C: ±30%
tan
δ:6%
max.
R
ins
: 1000 MΩ or R
i
C
R
≥
100 s,
whichever is less
4.15
endurance
2003 Jul 08 Rev.6
9
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YAGEO [ YAGEO CORPORATION ]
