Active-Semi
ORDERING INFORMATION
PART NUMBER
ACT4303YH-T
ACT4303
Rev 0, 05-Dec-11
OPERATION TEMPERATURE RANGE
-40°C to 85°C
PACKAGE
SOP-8EP
PINS
8
PACKING
TAPE & REEL
PIN CONFIGURATION
PIN DESCRIPTIONS
PIN
1
2
3
4
5
6
7
NAME
HSB
IN
SW
GND
FB
COMP
EN
DESCRIPTION
High Side Bias Pin. This provides power to the internal high-side MOSFET gate driver.
Connect a 22nF capacitor from HSB pin to SW pin.
Power Supply Input. Bypass this pin with a 10µF ceramic capacitor to GND, placed as
close to the IC as possible.
Power Switching Output to External Inductor.
Ground. Connect this pin to a large PCB copper area for best heat dissipation. Return
FB, COMP, and ISET to this GND, and connect this GND to power GND at a single
point for best noise immunity.
Feedback Input. The voltage at this pin is regulated to 0.808V. Connect to the resistor
divider between output and GND to set the output voltage.
Error Amplifier Output. This pin is used to compensate the converter.
Enable Input. EN is pulled up to 5V with a 4μA current, and contains a precise 1.6V
logic threshold. Drive this pin to a logic-high or leave unconnected to enable the IC.
Drive to a logic-low to disable the IC and enter shutdown mode.
Output Current Setting Pin. Connect a resistor from ISET to GND to program the
output current.
Heat Dissipation Pad. Connect this exposed pad to large ground copper area with
copper and vias.
8
ISET
Exposed Pad
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