ADG46+1/ADG46+3
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 6.
Parameter
Rating
VDD to VSS
18 V
VDD to GND
VSS to GND
Analog Inputs; VS to VD
Analog Inputs; VD , VS
Most Negative (VS,VD or VSS) to
Most Positive (VS,VD, Inx, or VDD)
−0.3 V to +18 V
+0.3 V to −± V
18 V
−± V to +18 V
18 V
Only one absolute maximum rating may be applied at any one
time.
THERMAL RESISTANCE
Digital Inputs, INx
GND − 0.3 V to +18 V
θJA is specified for a 4-layer board and, where applicable, with
the exposed pad soldered to the board.
Peak Current, Sx or Dx
350 mA (pulsed at 1 ms,
10% duty cycle max)
Continuous Current, Sx or Dx1
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
Temperature, Pb-free
Data + 15%
−40°C to +105°C
−65°C to +150°C
150°C
Table 7. Thermal Resistance
Package Type
16-Lead TSSOP
16-Lead LFCSP
θJA
Unit
°C/W
°C/W
112
48.±
260 (0/−5)°C
1 See Table 4.
ESD CAUTION
Rev. 0 | Page 9 of 24
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