ADuC7019/20/21/22/24/25/26/27/28/29
ABSOLUTE MAXIMUM RATINGS
AGND = REFGND = DACGND = GND
REF
, T
A
= 25°C, unless
otherwise noted.
Table 10.
Parameter
AV
DD
to IOV
DD
AGND to DGND
IOV
DD
to IOGND, AV
DD
to AGND
Digital Input Voltage to IOGND
Digital Output Voltage to IOGND
V
REF
to AGND
Analog Inputs to AGND
Analog Outputs to AGND
Operating Temperature Range, Industrial
Storage Temperature Range
Junction Temperature
θ
JA
Thermal Impedance
40-Lead LFCSP
49-Ball CSP_BGA
64-Lead LFCSP
64-Ball CSP_BGA
64-Lead LQFP
80-Lead LQFP
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
RoHS Compliant Assemblies
(20 sec to 40 sec)
Rating
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +6 V
−0.3 V to +5.3 V
−0.3 V to IOV
DD
+ 0.3 V
−0.3 V to AV
DD
+ 0.3 V
−0.3 V to AV
DD
+ 0.3 V
−0.3 V to AV
DD
+ 0.3 V
–40°C to +125°C
–65°C to +150°C
150°C
26°C/W
80°C/W
24°C/W
75°C/W
47°C/W
38°C/W
240°C
260°C
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
ESD CAUTION
Rev. F | Page 20 of 104
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