ADuC7019/20/21/22/24/25/26/27/28/29
Data Sheet
9.10
9.00 SQ
8.90
0.60 MAX
0.60
MAX
PIN 1
INDICATOR
49
48
64
1
PIN 1
INDICATOR
8.85
8.75 SQ
8.65
*
EXPOSED
PAD
0.50
BSC
4.85
4.70 SQ
4.55
0.50
0.40
0.30
33
32
16
17
0.25 MIN
BOTTOM VIEW
7.50 REF
TOP VIEW
0.80 MAX
0.65 TYP
12° MAX
1.00
0.85
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 98. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm x 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
12.20
12.00 SQ
0.75
11.80
0.60
0.45
1.60
MAX
64
49
1
48
PIN 1
10.20
10.00 SQ
9.80
TOP VIEW
(PINS DOWN)
1.45
1.40
1.35
0.20
0.09
7°
3.5°
0°
0.08
COPLANARITY
16
33
0.15
0.05
SEATING
PLANE
17
32
VIEW A
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
Figure 99. 64-Lead Low Profile Quad Flat Package [LQFP]
(ST-64-2)
Dimensions shown in millimeters
Rev. F | Page 98 of 104
ADI [ ADI ]
