Data Sheet
ADuC7019/20/21/22/24/25/26/27/28/29
14.20
14.00 SQ
13.80
0.75
0.60
0.45
1.60
MAX
80
61
60
1
PIN
1
12.20
12.00 SQ
11.80
TOP VIEW
(PINS DOWN)
1.45
1.40
1.35
0.20
0.09
7°
3.5°
0°
20
41
0.15
0.05
21
40
SEATING
PLANE
0.08
COPLANARITY
VIEW A
0.50
BSC
0.27
0.22
0.17
LEAD PITCH
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BDD
Figure 100. 80-Lead Low Profile Quad Flat Package [LQFP]
(ST-80-1)
Dimensions shown in millimeters
6.10
6.00 SQ
5.90
A1 CORNER
INDEX AREA
8
7
6
5
4
3
2
1
A
B
C
D
E
F
1.50
SQ
BALL A1
4.55 SQ
PAD CORNER
TOP VIEW
0.65
G
H
BOTTOM VIEW
DETAIL A
DETAIL A
*
1.40 MAX
0.65 MIN
0.15 MIN
COPLANARITY
0.10
0.45
0.40
0.35
SEATING
PLANE
BALL DIAMETER
*
COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
Figure 101. 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-64-4)
Dimensions shown in millimeters
Rev. F | Page 99 of 104
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