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EVAL-ADXL350Z-S 参数 Datasheet PDF下载

EVAL-ADXL350Z-S图片预览
型号: EVAL-ADXL350Z-S
PDF下载: 下载PDF文件 查看货源
内容描述: 数字加速度计 [Digital Accelerometer]
分类和应用:
文件页数/大小: 36 页 / 553 K
品牌: ADI [ ADI ]
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ADXL350  
Data Sheet  
Trigger Mode  
SELF-TEST  
In trigger mode, FIFO accumulates samples, holding the latest  
32 samples from measurements of the x-, y-, and z-axes. After  
a trigger event occurs and an interrupt is sent to the INT1 or  
INT2 pin (determined by the trigger bit in the FIFO_CTL register),  
FIFO keeps the last n samples (where n is the value specified by  
the samples bits in the FIFO_CTL register) and then operates in  
FIFO mode, collecting new samples only when FIFO is not full.  
The ADXL350 incorporates a self-test feature that effectively  
tests its mechanical and electronic systems simultaneously.  
When the self-test function is enabled (via the SELF_TEST bit  
in the DATA_FORMAT register, Address 0x31), an electrostatic  
force is exerted on the mechanical sensor. This electrostatic force  
moves the mechanical sensing element in the same manner as  
acceleration, and it is additive to the acceleration experienced  
by the device. This added electrostatic force results in an output  
change in the x-, y-, and z-axes. Because the electrostatic force  
A delay of at least 5 μs should be present between the trigger event  
occurring and the start of reading data from the FIFO to allow  
the FIFO to discard and retain the necessary samples. Additional  
trigger events cannot be recognized until the trigger mode is  
reset. To reset the trigger mode, set the device to bypass mode  
and then set the device back to trigger mode. Note that the  
FIFO data should be read first because placing the device into  
bypass mode clears FIFO.  
2
is proportional to VS , the output change varies with VS.  
The self-test feature of the ADXL350 also exhibits a bimodal  
behavior that depends on which phase of the clock self-test is  
enabled. However, the limits shown in Table 1 and Table 13  
to Table 16 are valid for all potential self-test values across the  
entire allowable voltage range. Use of the self-test feature at data  
rates less than 100 Hz may yield values outside these limits.  
Therefore, the part should be placed into a data rate of 100 Hz  
or greater when using self-test.  
Retrieving Data from FIFO  
The FIFO data is read through the DATAX, DATAY, and DATAZ  
registers (Address 0x32 to Address 0x37). When the FIFO is in  
FIFO, stream, or trigger mode, reads to the DATAX, DATAY,  
and DATAZ registers read data stored in the FIFO. Each time  
data is read from the FIFO, the oldest x-, y-, and z-axes data are  
placed into the DATAX, DATAY, and DATAZ registers.  
Table 13. Self-Test Output in LSB for 1 g, 10-bit Resolution  
or any g-Range, Full Resolution  
Axis  
Min  
Max  
1180  
−100  
1850  
Unit  
LSB  
LSB  
LSB  
X
Y
Z
100  
−1180  
150  
If a single-byte read operation is performed, the remaining  
bytes of data for the current FIFO sample are lost. Therefore, all  
axes of interest should be read in a burst (or multiple-byte) read  
operation. To ensure that the FIFO has completely popped (that  
is, that new data has completely moved into the DATAX, DATAY,  
and DATAZ registers), there must be at least 5 μs between the  
end of reading the data registers and the start of a new read of  
the FIFO or a read of the FIFO_STATUS register (Address 0x39).  
The end of reading a data register is signified by the transition  
Table 14. Self-Test Output in LSB for 2 g, 10-Bit Resolution  
Axis  
Min  
Max  
590  
−50  
925  
Unit  
LSB  
LSB  
LSB  
X
Y
Z
50  
−590  
75  
Table 15. Self-Test Output in LSB for 4 g, 10-Bit Resolution  
CS  
from Register 0x37 to Register 0x38 or by the  
pin going high.  
Axis  
Min  
Max  
295  
−25  
463  
Unit  
LSB  
LSB  
LSB  
For SPI operation at 1.6 MHz or less, the register addressing  
portion of the transmission is a sufficient delay to ensure that  
the FIFO has completely popped. For SPI operation greater than  
X
Y
Z
25  
−295  
38  
CS  
1.6 MHz, it is necessary to deassert the  
pin to ensure a total  
delay of 5 μs; otherwise, the delay will not be sufficient. The total  
delay necessary for 5 MHz operation is at most 3.4 μs. This is  
not a concern when using I2C mode because the communication  
rate is low enough to ensure a sufficient delay between FIFO reads.  
Table 16. Self-Test Output in LSB for 8 g, 10-Bit Resolution  
Axis  
Min  
Max  
148  
−12  
232  
Unit  
LSB  
LSB  
LSB  
X
12  
Y
Z
−148  
19  
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